Rate–Heat Bonding Compass | Tengyang

Rate–Heat Bonding Compass

Route the first controlled hot melt adhesive trial by process pace, service heat, sustained load, and moisture. The result identifies what to measure first; it is not a material-grade recommendation or a universal press recipe.

Describe the Process Window

Discuss Your Bonding Process

First-Test Route

Protect wet-out time

First measurement

Measure incoming substrate and bond-line temperature.

Priority checks

  • Record mating delay and cooling path.
  • Confirm surface preparation and bond geometry.

Decision boundary

Use the result to organize a controlled trial. The exact TPU, EVA, PA, PES, or PO grade still requires the real substrate pair, adhesive dimensions, process record, and acceptance test.